INDICON 2024: Best Paper award for Cutting-Edge UVM Framework

INDICON, the flagship annual international conference of IEEE India Council, has been a prestigious platform for innovation in Computer Science, Electrical Engineering, and Electronics & Communication Engineering. It has evolved from the Annual Convention and Exhibitions (ACE) into a renowned conference where thought leaders and researchers converge. This year marked a special milestone as IEEE Kharagpur Section hosted INDICON 2024, 20 years after organizing the very first INDICON in 2004.

We are thrilled to share that the Mettlesemi team had a remarkable presence at this prestigious conference. Our team members Mangu Venkata Krishna Kalyan, Mukka Vineeth & Sriram Rajagopalan presented their paper “Robust Modular UVM Framework for Peripheral Verification” and were awarded the Best Paper among the following tracks:

  • VLSI and Nanotechnology
  • Control and Automation
  • Others

Paper Overview

In today’s rapidly evolving semiconductor landscape, ensuring robust verification methodologies is critical. Traditional testbenches often fall short in terms of reusability, scalability, and flexibility for verifying multiple protocols. Our work proposes a Modular UVM Framework that offers:

  • Reusable components to reduce development time across projects
  • Improved readability and debugging by isolating functionalities
  • Integration into automated verification flows for continuous testing
  • Customizability to support multiple protocols with minimal effort
  • Reduction in testbench development time, accelerating verification and time-to-market

Key Objectives & Impact

  • Develop a UVM testbench environment for I2C and SPI protocols
  • Enable multiple test cases and regression testing
  • Create a reusable framework to verify different peripheral protocols
  • Automate the verification process with Python scripting
  • Integrate with AXI4 Lite interface for enhanced functionality

Key Takeaways

  • Framework Success: Verified I2C and SPI protocols with a robust modular
    structure
  • Automation: Python scripting enables quick adaptation for different
    protocols
  • Verification Results:
    Executed multiple test cases as per I2C and SPI specifications
    Successful transactions between master and slave devices
    Scoreboard results confirmed data integrity and transaction success
  • Scalability & Efficiency: Our framework significantly improves the efficiency
    of peripheral verification processes

This achievement underscores Mettlesemi’s commitment to innovation in semiconductor design and verification. A huge congratulations to our team for this incredible milestone. This paper has been published:
https://ieeexplore.ieee.org/document/10958262